Project:

Sony, clamshell packaging for headphones

Scope:

Design a package configuration for a headset. Must be scanned hook capable. It has to be consistent with the current product image and make it snappy.

Result:

Heads up a perfect fit. Sony no balogne.

Materials Used:

Clear PETG, Aluminum molds, steel rule die set.

Production
Techniques:

In-line vacuum form and die cut.
Aluminum tooling.

Design:

Quality Plastic Industries.

Timeline:

Design two days,
tooling one week,
production parts two weeks.