Project:

Intel, SK-9 Probe card shipping container.

Scope:

Intel provided a list of requirements and asked for a design which could adapt those requirements. Included were the physical dimensions of the probe card,and a drop test requirement. The package had to have anti-static characteristics.

Result:

A "standard" was achieved. The SK-9 package design is used worldwide by Intel approved suppliers.

Materials Used:

PETG, ABS, Anti-static coating.

Production
Techniques:

Vacuum form, CNC 5 axis routering,
Anti-static coating.

Design:

Quality Plastic Industries.

Timeline:

Design: two weeks,
tooling: one week,
production parts: three weeks